to replace the older IPC-7351B. It provides updated requirements and guidelines for the design of surface mount land patterns on printed boards.

Where small components stand up on one end during reflow. Solder Bridging: Where solder shorts two adjacent pins.

Please clarify which type of "post" you need, and I will write it immediately.

It reverts the component naming convention to the style used in IPC-7351B, placing the at the end of the footprint name.

Instead of memorizing these, most engineers use the standardized in Appendix A of the PDF. For example, for a 0402 resistor (1.0mm x 0.5mm):

The IPC-7352 PDF is a standard published by the IPC, which provides guidelines for the design and manufacturing of surface mount technology (SMT) and through-hole technology (THT) components. The document is titled "IPC-7352 Component Land Pattern Guidelines" and provides a comprehensive guide for designers and manufacturers to ensure the reliability and performance of electronic assemblies.

But as electronics shrank and tolerances tightened, the old bible needed a new testament. Enter .